Soldering of Components on Printed-Circuit Boards

Description

The solder data frame has 720 rows and 6 columns, representing a balanced subset of a designed experiment varying 5 factors on the soldering of components on printed-circuit boards.

Usage

solder

Format

This data frame contains the following columns:

Opening

a factor with levels L M S indicating the amount of clearance around the mounting pad.

Solder

a factor with levels Thick Thin giving the thickness of the solder used.

Mask

a factor with levels A1.5 A3 B3 B6 indicating the type and thickness of mask used.

PadType

a factor with levels D4 D6 D7 L4 L6 L7 L8 L9 W4 W9 giving the size and geometry of the mounting pad.

Panel

1:3 indicating the panel on a board being tested.

skips

a numeric vector giving the number of visible solder skips.

Source

John M. Chambers and Trevor J. Hastie eds. (1992) Statistical Models in S, Wadsworth and Brooks/Cole, Pacific Grove, CA 1992.

Examples

fit <- rpart(skips ~ Opening + Solder + Mask + PadType + Panel,
       data=solder, method='anova')
summary(residuals(fit))
plot(predict(fit),residuals(fit))